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Shanghai Tongpeng Electronic Material Co., Ltd.


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Our company is a Sino-Japanese joint venture manufacturer specializing in packaging with 15 years of experience in blister packaging production. We have factories in China (Dongguan and Shanghai), Japan, and Philippines.


The products are sold in various regions of China and exported to the United States, Australia, Germany and Southeast Asia.

Thinking for the customer, meeting the customer requirements, is always our company orientation.



With high cleanliness and precision as the first goal, we are working under the integrated production, which starts from the planning of the processing technology of the mould for vacuum blistering, the electronic parts tray, the product packaging box, the clean box, etc., to the product design, the drawing, the product trial production, the performance evaluation, the mould production and the product mass production.


We started business from the precision electronic components blister packaging. We managed to develop our products and services to meet the needs of customers from different fields, such as design, mold processing, molding, cleaning, inspection and other comprehensive development of high-precision, high-quality, additional function and value-added products as pallets, protective materials and packaging materials in various fields to meet the needs of customers.

Our company cooperates with well-known enterprises, including Finisar, Omron, Canon, MOLEX, etc.



Company Profile
Company Name: Shanghai Tongpeng Electronic Material Co., Ltd. Type of company: Enterprise Units ()
Place of Origin: Beijing Company Size:
Registered Capital: Not filled Year of Registration: 2002
Data certification:        Enterprise data through authenticate
Industry: